,,ii #aafth ,,congress #b;d ,session ,s4 #cicc ,,in ,,the ,,senate ,,of ,,the ,,united ,,states ,june #aj1 #bjbj,mr4 ,cornyn 7for himself1 ,mr4 ,warner1 ,mr4 ,risch1 ,mr4 ,rubio1 and ,ms4 ,sinema7 introduced the following bill2 which was read twice and referred to the ,committee on ,finance ,a ,,bill ,to restore ,american leadership in semiconductor manufacturing by increasing ,federal incentives in order to enable advanced research and development1 secure the supply chain1 and ensure long-term national security and economic competitiveness4 #a4 ,short title ,this ,act may be cited as the ,creating ,helpful ,incentives to ,produce ,semiconductors for ,america ,act or the ,,chips for ,america ,act4 #b4 ,semiconductor investment tax credit 7a7 ,establishment of credit ,subpart ,e of part ,,iv of subchapter ,a of chapter #a of the ,internal ,revenue ,code of #aihf is amended by inserting after section #dh;,c the following3 #dh;,d4 ,qualifying semiconductor equipment credit 7a7 ,in general ,for purposes of section #df1 the qualifying semiconductor equipment credit for any taxable year is the applicable percentage of-- 7#a7 the basis of any qualified semiconductor equipment placed in service during such taxable year1 7#b7 any qualified semiconductor manufacturing facility investment expenditures incurred during such taxable year1 and 7#c7 any expenses incurred by the taxpayer during such taxable year with respect to entering into a lease 7including renewal or extension of a lease7 for qualified semiconductor equipment4 7b7 ,applicable percentage ,for purposes of subsection 7a71 the applicable percentage is-- 7#a7 #dj percent in the case of any qualified semiconductor equipment which is placed in service before ,january #a1 #bjbe1 or any qualified semiconductor manufacturing facility investment expenditures or expenses described in subsection 7a77#c7 which are incurred before such date1 7#b7 #cj percent in the case of any such equipment which is placed in service1 or any such expenditures or expenses which are incurred1 after ,december #ca1 #bjbd1 and before ,january #a1 #bjbf1 7#c7 #bj percent in the case of any such equipment which is placed in service1 or any such expenditures or expenses which are incurred1 after ,december #ca1 #bjbe1 and before ,january #a1 #bjbg1 and 7#d7 #j percent in the case of any such equipment which is placed in service1 or any such expenditures or expenses which are incurred1 after ,december #ca1 #bjbf4 7c7 ,qualified semiconductor equipment ,for purposes of this section1 the term qualified semiconductor equipment means any property-- 7#a7 which has been identified by the ,secretary1 in consultation with the ,secretary of ,commerce1 as machinery or equipment that is designed and used to-- 7,a7 manufacture or process semiconductors1 or 7,b7 perform research with respect to semiconductors1 7#b7 which is placed in service in the ,united ,states by the taxpayer1 and 7#c7 with respect to which depreciation 7or amortization in lieu of depreciation7 is allowable4 7d7 ,qualified semiconductor manufacturing facility investment expenditures ,for purposes of this section1 the term qualified semiconductor manufacturing facility investment expenditure means any amount properly chargeable to capital account-- 7#a7 for property for which depreciation is allowable under section #afh1 and 7#b7 in connection with the construction or upgrading of any facility located in the ,united ,states which substantially operates qualified semiconductor equipment1 including-- 7,a7 costs relating to-- 7i7 acquiring or upgrading an existing building1 or 7ii7 construction of a new building1 and 7,b7 property such as-- 7i7 integrated systems1 fixtures1 piping1 movable partitions1 and lighting1 and 7ii7 any property which has been identified by the ,secretary1 in consultation with the ,secretary of ,commerce1 as necessary or adapted to-- 7,i7 reduce contamination1 or 7,,ii7 control air flow1 temperature1 humidity1 chemical purity1 or other environmental conditions or manufacturing tolerances4 7e7 ,certain progress expenditure rules made applicable ,rules similar to the rules of subsections 7c77#d7 and 7d7 of section #df 7as in effect on the day before the date of the enactment of the ,revenue ,reconciliation ,act of #aiij7 shall apply for purposes of subsection 7a74 7f7 ,treatment of credit ,the amount of the credit determined under this section with respect to any qualified semiconductor equipment placed in service before ,january #a1 #bjbg1 or any qualified semiconductor manufacturing facility investment expenditures incurred before such date1 shall be treated as a credit allowable under subpart ,c 7and not allowable under section #ch74 7g7 ,denial of double benefit 7#a7 ,reduction of basis ,if a credit is determined under this section with respect to any property1 the basis of such property shall be reduced by the amount of the credit so determined4 7#b7 ,other credits ,no credit shall be allowed under any provision of this chapter with respect to any amount taken in account in determining the credit allowed to a taxpayer under this section4 7h7 ,rules relating to leased property ,for purposes of subsection 7a77#c71 rules similar to the rules under section #dh7;d7 7as in effect on the day before the date of the enactment of the ,revenue ,reconciliation ,act of #aiij7 shall apply4 7i7 ,disallowance ,no credit shall be allowed under this section with respect to any qualified semiconductor equipment which is used predominantly outside the ,united ,states4 7j7 ,partnerships ,in the case of a credit under subsection 7a7 which is determined at the partnership level1 with respect to any partner which is exempt from taxation under section #eja7;a71 such partner may elect to transfer their distributive share of such credit to any other partner in the partnership4 7k7 ,regulations ,the ,secretary shall prescribe such regulations or other guidance as may be necessary to carry out the purposes of this section1 including any such measures as are deemed appropriate to avoid abuse or fraud with respect to the credit allowed under this section4 4 7b7 ,tax on base erosion payments of taxpayers with substantial gross receipts ,section #ei;,a7b77#a77;,b77ii7 of the ,internal ,revenue ,code of #aihf is amended-- 7#a7 in subclause 7,,ii71 by striking the period at the end and inserting 1 plus1 and 7#b7 by adding at the end the following3 7,,iii7 the credit determined under section #dh;,d for the taxable year4 4 7c7 ,investment credit ,section #df of the ,internal ,revenue ,code of #aihf is amended by striking and at the end of paragraph 7#e71 by striking the period at the end of paragraph 7#f7 and inserting 1 and1 and by adding at the end the following new paragraph3 7#g7 the qualifying semiconductor equipment credit4 4 7d7 ,clerical amendment ,the table of sections for subpart ,e of part ,,iv of subchapter ,a of chapter #a of the ,internal ,revenue ,code of #aihf is amended by inserting after the item relating to section #dh;,c the following new item3 ,sec4 #dh;,d4 ,qualifying semiconductor equipment credit4 4 7e7 ,effective date ,the amendments made by this section shall apply to any qualified semiconductor equipment 7as defined in subsection 7c7 of section #dh;,d7 placed in service after the date of enactment of this ,act1 or any qualified semiconductor manufacturing facility investment expenditure 7as defined in subsection 7d7 of such section7 incurred after such date4 #c4 ,building ,united ,states capacity for verification and manufacturing of advanced microelectronics 7a7 ,program ,the ,secretary of ,commerce1 acting through the ,director of the ,national ,institute of ,standards and ,technology1 shall carry out a program of research and development investment to enable advances and breakthroughs in measurement science1 standards1 material characterization1 instrumentation1 testing1 and manufacturing capabilities that will accelerate the underlying research and development for design1 development1 and manufacturability of next generation microelectronics and ensure the competitiveness and leadership of the ,united ,states within this sector4 7b7 ,components ,the program required by subsection 7a7 shall cover the following3 7#a7 ,advanced metrology and characterization for manufacturing of microchips using #c nanometer transistor processes or more advanced processes4 7#b7 ,metrology for security and supply chain verification4 7#c7 ,creation of a ,manufacturing ,,usa institute described in section #cd7;d7 of the ,national ,institute of ,standards and ,technology ,act 7#ae ,u4,s4,c4 #bghs7d77 that is focused on semiconductor manufacturing4 ,such institute may emphasize the following3 7,a7 ,research to support the virtualization and automation of maintenance of semiconductor machinery4 7,b7 ,development of new advanced test1 assembly and packaging capabilities4 7,c7 ,developing and deploying educational and skills training curricula needed to support the industry sector and ensure the ,u4,s4 can build and maintain a trusted and predictable talent pipeline4 7c7 ,authorization of appropriations ,there are authorized to be appropriated to the ,secretary amounts as follows3 7#a7 ,to carry out subsection 7b77#a71 #aj1jjj1jjj for each of fiscal years #bjba through #bjbe4 7#b7 ,to carry out subsection 7b77#b71 #aj1jjj1jjj for each of fiscal years #bjba through #bjbe4 7#c7 ,to carry out subsection 7b77#c71 #cj1jjj1jjj for each of fiscal years #bjba through #bjbe4 #d4 ,federal grants to match ,state incentives 7a7 ,definitions ,in this section-- 7#a7 the term appropriate committees of ,congress means-- 7,a7 the ,select ,committee on ,intelligence1 the ,committee on ,commerce1 ,science1 and ,transportation1 the ,committee on ,foreign ,relations1 the ,committee on ,armed ,services1 and the ,committee on ,homeland ,security and ,governmental ,affairs of the ,senate2 and 7,b7 the ,permanent ,select ,committee on ,intelligence1 the ,committee on ,energy and ,commerce1 the ,committee on ,foreign ,affairs1 the ,committee on ,armed ,services1 the ,committee on ,science1 ,space1 and ,technology1 and the ,committee on ,homeland ,security of the ,house of ,representatives2 7#b7 the term covered incentive-- 7,a7 means an incentive offered by a governmental entity to a private entity for the purposes of building within the jurisdiction of the governmental entity a fabrication 7or other essential7 facility relating to the manufacturing of semiconductors2 and 7,b7 includes any tax incentive 7such as an incentive or reduction with respect to employment or payroll taxes or a tax abatement with respect to personal or real property71 a workforce-related incentive 7including a grant agreement relating to workforce training or vocational education71 any concession with respect to real property1 and any other incentive determined appropriate by the ,secretary1 in consultation with the ,secretary of ,state2 7#c7 the term governmental entity means a ,state or local government2 and 7#d7 the term ,secretary means the ,secretary of ,commerce4 7b7 ,grants 7#a7 ,in general ,the ,secretary shall establish in the ,department of ,commerce a program that1 in accordance with the requirements of this section1 provides grants to governmental entities that offer covered incentives4 7#b7 ,procedure 7,a7 ,in general ,a governmental entity that offers a covered incentive and that desires to receive a grant under this subsection shall submit to the ,secretary an application that describes the covered incentive offered by the governmental entity4 7,b7 ,conditions for approval ,the ,secretary shall approve an application submitted by a governmental entity under subparagraph 7,a7-- 7i7 upon confirmation by the ,secretary that the private entity to which the governmental entity has offered the covered incentive to which the application relates has agreed to build in the applicable jurisdiction a facility described in subsection 7a77#b77;,a72 and 7ii7 if the ,secretary determines that building the facility described in clause 7i7 is in the interest of the ,united ,states4 7#c7 ,amount ,the amount of a grant provided by the ,secretary to a governmental entity under this subsection shall be in an amount that is not less than the value of the applicable covered incentive offered by the governmental entity1 as determined by the ,secretary4 7#d7 ,clawback ,the ,secretary shall recover the full amount of a grant made to a governmental entity under this subsection with respect to a covered incentive offered by the governmental entity if-- 7,a7 as of the date that is #e years after the date on which the ,secretary makes the grant1 the facility to which the covered incentive relates has not been completed2 or 7,b7 during the term of the grant1 the private entity to which the covered incentive was offered engages in any joint research or technology licensing effort-- 7i7 with the ,government of the ,people's ,republic of ,china1 the ,government of the ,russian ,federation1 the ,government of ,iran1 or the ,government of ,north ,korea2 and 7ii7 that relates to a sensitive technology or product1 as determined by the ,secretary4 7c7 ,consultation and coordination required ,in carrying out the program established under subsection 7b71 the ,secretary shall consult and coordinate with the ,secretary of ,state4 7d7 ,,gao reviews ,the ,comptroller ,general of the ,united ,states shall-- 7#a7 not later than #b years after the date of enactment of this ,act1 and biennially thereafter until the date that is #aj years after that date of enactment1 conduct a review of the program established under subsection 7b71 which shall include a determination of the number of grants made under that program during the period covered by the review that failed to comply with a requirement under this section2 and 7#b7 submit to the appropriate committees of ,congress the results of each review conducted under paragraph 7#a74 7e7 ,trust ,fund 7#a7 ,establishment ,there is established in the ,treasury of the ,united ,states a trust fund 7referred to in this subsection as the ,trust ,fund71 consisting of amounts transferred to the ,trust ,fund under paragraph 7#b7 and any amounts that may be credited to the ,trust ,fund under paragraph 7#c74 7#b7 ,transfer of amounts 7,a7 ,in general ,subject to subparagraph 7,b71 the ,secretary of the ,treasury shall transfer to the ,trust ,fund1 from the general fund of the ,treasury1 for fiscal year #bjba and each fiscal year thereafter1 an amount equivalent to the amount received into the general fund during that fiscal year and attributable to duties imposed under section #cja of the ,trade ,act of #aigd 7#ai ,u4,s4,c4 #bdaa74 7,b7 ,limitations 7i7 ,limitation on transfers ,the amount transferred to the ,trust ,fund under subparagraph 7,a7 in a fiscal year may not exceed #aj1jjj1jjj1jjj4 7ii7 ,limitation on total balance ,the total amount in the ,trust ,fund at any one time may not exceed #aj1jjj1jjj1jjj4 7,c7 ,frequency of transfers ,the ,secretary shall transfer amounts required to be transferred to the ,trust ,fund under this paragraph not less frequently than quarterly from the general fund of the ,treasury to the ,trust ,fund4 7#c7 ,investment of amounts 7,a7 ,investment of amounts ,the ,secretary shall invest such portion of the ,trust ,fund as is not required to meet current withdrawals in interest-bearing obligations of the ,united ,states or in obligations guaranteed as to both principal and interest by the ,united ,states4 7,b7 ,interest and proceeds ,the interest on1 and the proceeds from the sale or redemption of1 any obligations held in the ,trust ,fund shall be credited to and form a part of the ,trust ,fund4 7#d7 ,availability of amounts in ,trust ,fund ,amounts in the ,trust ,fund shall be available1 as provided in advance in an appropriations ,act1 to the ,secretary to make grants under this section4 #e4 ,department of ,defense support for semiconductor technologies and related technologies 7a7 ,,rdt,e and workforce training efforts 7#a7 ,in general ,the ,secretary of ,defense shall1 in consultation with the ,secretary of ,commerce and the ,secretary of ,labor1 establish and implement a priority in the use of amounts available to the ,department of ,defense for research1 development1 test1 and evaluation1 and for workforce training1 for programs1 projects1 and activities in connection with semiconductor technologies and related technologies4 7#b7 ,discharge ,the ,secretary of ,defense shall carry out paragraph 7#a7 through the ,office of the ,under ,secretary of ,defense for ,research and ,engineering or such other component of the ,department of ,defense as the ,secretary considers appropriate4 7#c7 ,funding ,of the amount authorized to be appropriated for each fiscal year for the ,department of ,defense for research1 development1 test1 and evaluation1 not less the #ej1jjj1jjj shall be available in such fiscal year for programs1 projects1 and activities described in paragraph 7#a7 in furtherance of the priority required by that paragraph4 7b7 ,,dpa efforts 7#a7 ,in general ,not later than #abj days after the date of the enactment of this ,act1 the ,president shall submit to ,congress a report on1 and shall commence implementation of1 a plan for use by the ,department of ,defense of authorities available in title ,,iii of the ,defense ,production ,act of #aiej 7#ej ,u4,s4,c4 #deca et seq47 to establish and enhance a domestic production capability for semiconductor technologies and related technologies1 if funding is available for that purpose4 7#b7 ,consultation ,the ,president shall develop the plan required by paragraph 7#a7 in consultation with the ,secretary of ,defense1 the ,secretary of ,state1 the ,secretary of ,commerce1 and appropriate stakeholders in the private sector4 #f4 ,department of ,commerce study on status of semiconductor technologies in the ,united ,states industrial base 7a7 ,in general ,commencing not later than #ij days after the date of the enactment of this ,act1 the ,secretary of ,commerce shall undertake a survey1 using authorities in section #gje of the ,defense ,production ,act 7#ej ,u4,s4,c4 #deee71 to assess the capabilities of the ,united ,states industrial base to support the national defense in light of the global nature of the supply chain and significant interdependencies between the ,united ,states industrial base and the industrial base of foreign countries with respect to the manufacture and design of semiconductors4 7b7 ,response to survey ,the ,secretary shall ensure compliance with the survey from among all relevant potential respondents1 including the following3 7#a7 ,corporations1 partnerships1 associations1 or any other organized groups domiciled and with substantial operations in the ,united ,states4 7#b7 ,corporations1 partnerships1 associations1 or any other organized groups domiciled in the ,united ,states with operations outside the ,united ,states4 7#c7 ,foreign domiciled corporations1 partnerships1 associations1 or any other organized groups with substantial operations or business presence in1 or substantial revenues derived from1 the ,united ,states4 7#d7 ,foreign domiciled corporations1 partnerships1 associations1 or any other organized groups in defense treaty or assistance countries where the production of the entity concerned involves critical technologies covered by section #c4 7c7 ,information requested ,the information sought from a responding entity pursuant to the survey required by subsection 7a7 shall include1 at minimum1 information on the following with respect to the manufacture or design of semiconductors by such entity3 7#a7 ,an identification of the geographic scope of operations4 7#b7 ,information on relevant cost structures4 7#c7 ,an identification of types of semiconductor equipment in operation at such entity4 7#d7 ,an identification of all relevant raw materials and semi-finished goods and components sourced domestically and abroad by such entity4 7#e7 ,specifications of the semiconductors manufactured or designed by such entity1 descriptions of the end-uses of such semiconductors1 and a description of any technical support provided to end-users of such semiconductors by such entity4 7#f7 ,information on domestic and export market sales by such entity4 7#g7 ,information on the financial performance1 including income and expenditures1 of such entity4 7#h7 ,a list of all foreign and domestic subsidies1 and any other financial incentives1 received by such entity in each market in which such entity operates4 7#i7 ,a list of information requests from the ,people's ,republic of ,china to such entity1 and a description of the nature of each request and the type of information provided4 7#aj7 ,information on any joint ventures1 technology licensing agreements1 and cooperative research or production arrangements of such entity4 7#aa7 ,a description of efforts by such entity to evaluate and control supply chain risks it faces4 7#ab7 ,a list and description of any sales1 licensing agreements1 or partnerships between such entity and the ,people's ,liberation ,army or ,people's ,armed ,police1 including any business relationships with entities through which such sales1 licensing agreements1 or partnerships may occur4 #g4 ,funding for development and adoption of secure microelectronics and secure microelectronics supply chains 7a7 ,multilateral ,microelectronics ,security ,fund 7#a7 ,establishment of fund ,there is established in the ,treasury of the ,united ,states a trust fund1 to be known as the ,multilateral ,microelectronics ,security ,fund 7in this section referred to as the ,fund71 consisting of amounts deposited into the ,trust ,fund under paragraph 7#b7 and any amounts that may be credited to the ,trust ,fund under paragraph 7#c74 7#b7 ,authorization of appropriations ,there are authorized to be appropriated #gej1jjj1jjj to be deposited in the ,fund4 7#c7 ,investment of amounts 7,a7 ,investment of amounts ,the ,secretary of the ,treasury shall invest such portion of the ,fund as is not required to meet current withdrawals in interest-bearing obligations of the ,united ,states or in obligations guaranteed as to both principal and interest by the ,united ,states4 7,b7 ,interest and proceeds ,the interest on1 and the proceeds from the sale or redemption of1 any obligations held in the ,fund shall be credited to and form a part of the ,fund4 7#d7 ,use of fund 7,a7 ,in general ,subject to subparagraph 7,b71 amounts in the ,fund shall be available1 as provided in advance in an appropriations ,act1 to the ,secretary of ,state-- 7i7 to provide funding through the common funding mechanism described in subsection 7b77#a7 to support the development and adoption of secure microelectronics and secure microelectronics supply chains2 and 7ii7 to otherwise carry out this section4 7,b7 ,availability contingent on international agreement ,amounts in the ,fund shall be available to the ,secretary of ,state on and after the date on which the ,secretary enters into an agreement with the governments of countries that are partners of the ,united ,states to participate in the common funding mechanism under paragraph 7#a7 of subsection 7b7 and the commitments described in paragraph 7#b7 of that subsection4 7#e7 ,availability of amounts 7,a7 ,in general ,amounts in the ,fund shall remain available through the end of the tenth fiscal year beginning after the date of the enactment of this ,act4 7,b7 ,remainder to treasury ,any amounts remaining in the ,fund after the end of the fiscal year described in subparagraph 7,a7 shall be deposited in the general fund of the ,treasury4 7b7 ,common funding mechanism for development and adoption of secure microelectronics and secure microelectronics supply chains 7#a7 ,in general ,the ,secretary of ,state1 in consultation with the ,secretary of ,commerce1 the ,secretary of ,defense1 the ,secretary of ,homeland ,security1 the ,secretary of the ,treasury1 and the ,director of ,national ,intelligence1 shall seek to establish a common funding mechanism1 in coordination with the governments of countries that are partners of the ,united ,states1 that uses amounts from the ,fund1 and amounts committed by such governments1 to support the development and adoption of secure microelectronics and secure microelectronics supply chains4 7#b7 ,mutual commitments ,the ,secretary of ,state1 in consultation with the ,united ,states ,trade ,representative and the ,secretary of ,commerce1 shall seek to negotiate a set of mutual commitments with the governments of countries that are partners of the ,united ,states upon which to condition any expenditure of funds pursuant to the common funding mechanism described in paragraph 7#a74 ,such commitments shall1 at a minimum-- 7,a7 establish transparency requirements for any subsidies or other financial benefits 7including revenue foregone7 provided to microelectronics firms located in or outside such countries2 7,b7 establish consistent policies with respect to countries that-- 7i7 are not participating in the common funding mechanism2 and 7ii7 do not meet transparency requirements established under subparagraph 7,a72 7,c7 promote harmonized treatment of microelectronics and verification processes for items being exported to a country considered a national security risk by a country participating in the common funding mechanism2 7,d7 establish consistent policies and common external policies to address nonmarket economies as the behavior of such countries pertains to microelectronics2 and 7,e7 align policies on supply chain integrity and microelectronics security4 7c7 ,annual report to congress ,not later than one year after the date of the enactment of this ,act1 and annually thereafter for each fiscal year during which amounts in the ,fund are available under subsection 7a77#c71 the ,secretary of ,state shall submit to ,congress a report on the status of the implementation of this section that includes a description of-- 7#a7 any commitments made by the governments of countries that are partners of the ,united ,states to providing funding for the common funding mechanism described in subsection 7b77#a7 and the specific amount so committed2 7#b7 the criteria established for expenditure of funds through the common funding mechanism2 7#c7 how1 and to whom1 amounts have been expended from the ,fund2 7#d7 amounts remaining in the ,fund2 7#e7 the progress of the ,secretary of ,state toward entering into an agreement with the governments of countries that are partners of the ,united ,states to participate in the common funding mechanism and the commitments described in subsection 7b77#b72 and 7#f7 any additional authorities needed to enhance the effectiveness of the ,fund in achieving the security goals of the ,united ,states4 #h4 ,advanced semiconductor research and design 7a7 ,appropriate committees of ,congress ,in this section1 the term appropriate committees of ,congress means-- 7#a7 the ,select ,committee on ,intelligence1 the ,committee on ,commerce1 ,science1 and ,transportation1 the ,committee on ,foreign ,relations1 the ,committee on ,armed ,services1 and the ,committee on ,homeland ,security and ,governmental ,affairs of the ,senate2 and 7#b7 the ,permanent ,select ,committee on ,intelligence1 the ,committee on ,energy and ,commerce1 the ,committee on ,foreign ,affairs1 the ,committee on ,armed ,services1 the ,committee on ,science1 ,space1 and ,technology1 and the ,committee on ,homeland ,security of the ,house of ,representatives4 7b7 ,sense of ,congress ,it is the sense of ,congress that the leadership of the ,united ,states in semiconductor technology and innovation is critical to the economic growth and national security of the ,united ,states4 7c7 ,subcommittee on semiconductor leadership 7#a7 ,establishment required ,the ,president shall establish in the ,national ,science and ,technology ,council a subcommittee on matters relating to leadership of the ,united ,states in semiconductor technology and innovation4 7#b7 ,duties ,the duties of the subcommittee established under paragraph 7#a7 are as follows3 7,a7 ,national strategy on semiconductor research 7i7 ,development ,in coordination with the ,secretary of ,defense1 the ,secretary of ,energy1 the ,secretary of ,state1 the ,secretary of ,commerce1 the ,national ,science ,foundation1 and the ,director of the ,national ,institute of ,standards and ,technology and in consultation with the semiconductor industry and academia1 develop a national strategy on semiconductor research1 including guidance for the funding of research4 7ii7 ,reporting and updates ,not less frequently than once every #e years1 to update the strategy developed under clause 7i7 and to submit the revised strategy to the appropriate committees of ,congress4 7,b7 ,fostering coordination of research and development ,to foster the coordination of semiconductor research and development4 7d7 ,advanced ,packaging ,national ,manufacturing ,institute 7#a7 ,authorization ,the ,secretary of ,commerce may1 in coordination with the private sector1 establish in the ,department of ,commerce an institute on advanced packaging and manufacturing4 7#b7 ,functions ,the functions of the institute established under paragraph 7#a7 shall be as follows3 7,a7 ,to establish ,united ,states leadership in advanced microelectronic packaging4 7,b7 ,to promote standards development for such packaging4 7,c7 ,to foster public-private partnerships relevant to such packaging4 7,d7 ,to develop research and development programs to advance technology development relevant to such packaging4 7,e7 ,to establish an investment fund-- 7i7 to support a startup domestic advanced microelectronic packaging ecosystem2 7ii7 to accelerate technology transfer2 and 7iii7 to ensure domestic supply chains2 and 7,f7 to work with the ,secretary of ,labor and the private sector to develop workforce training programs and apprenticeships in advanced microelectronic packaging capabilities4 7e7 ,authorizations of appropriations 7#a7 ,national ,semiconductor ,technology ,center ,there is authorized to be appropriated to establish a national semiconductor technology center to conduct research and prototyping of advance semiconductors with participation of the private sector1 the ,secretary of ,defense1 the ,secretary of ,energy1 the ,national ,science ,foundation1 and the ,director of the ,national ,institute of ,standards and ,technology1 #c1jjj1jjj1jjj for fiscal year #bjba1 with such amount to remain available for such purpose through fiscal year #bjcj4 7#b7 ,electronics ,resurgence ,initiative ,there is authorized to be appropriated to carry out the ,electronics ,resurgence ,initiative of the ,defense ,advanced ,research ,projects ,agency1 #b1jjj1jjj1jjj for fiscal year #bjba1 with such amount to remain available for such purpose through fiscal year #bjbe4 7#c7 ,semiconductor basic research at ,national ,science ,foundation ,there is authorized to be appropriated to carry out programs at the ,national ,science ,foundation on semiconductor basic research1 #c1jjj1jjj1jjj for fiscal year #bjba1 with such amount to remain available for such purpose through fiscal year #bjbe4 7#d7 ,semiconductor basic research at ,department of ,energy ,there is authorized to be appropriated to carry out programs at the ,department of ,energy on semiconductor basic research1 #b1jjj1jjj1jjj for fiscal year #bjba1 with such amount to remain available for such purpose through fiscal year #bjbe4 7#e7 ,advanced ,packaging ,national ,manufacturing ,institute ,there is authorized to be appropriated to carry out subsection 7d71 #e1jjj1jjj1jjj for fiscal year #bjba1 with such amount to remain available for such purpose through fiscal year #bjbe-- 7,a7 of which1 #ejj1jjj1jjj shall be available to carry out paragraph 7#b77;,d7 of such subsection2 and 7,b7 of which1 #ejj1jjj1jjj shall be available to carry out paragraph 7#b77;,e7 of such subsection4